Numerical evaluation of thermal performance for diverse configurations
of pin fin heat sink with and without phase change materials (PCM)
Abstract
Regulation of the thermal performance of electrical components is a key
aspect. Phase-change materials can be incorporated into a fin heat sink
(FHS) to enhance thermal management by maintaining a stable temperature.
Three types (square, triangular, and circular) of aluminum FHSs of
different configurations are investigated numerically in this paper.
Studies are conducted with and without PCMs. Paraffin wax, stearic acid,
and polyethylene glycol are used as PCMs to find the best combinations
for thermal cooling and to determine the impact of using PCMs in the
heat sinks. The results obtained show that, by adding PCMs, temperature
rise can be delayed, and polyethylene glycol performs better than other
PCMs. Moreover, the square fin heat sink increases the thermal
regulation period. As the height of the fins increases from 10 mm to 16
mm, thermal efficiency increases. Hence, the findings of this paper
would be beneficial for effective thermal management in the electronic
industry.