In this study, we developed a novel preparation method for W-SiC film, an ideal insulation material for sensors, employing in situ laser sintering combined with ink-jet printing. We conducted a comprehensive investigation into the influence of laser power on the microstructural and mechanical properties of the films. Our results indicate that an optimal laser power of approximately 42.5 W produces a compact and well-bonded W-SiC film. Heat transfer analysis reveals that variations in the temperature field distribution at the coating-substrate interface are the primary cause of observed differences. Specifically, low laser power results in incomplete melting of nanoparticles, leading to dense, small voids, whereas excessive laser power causes oversintering of particles and significant thermal stress, resulting in large voids and cracks. This study elucidates a nonlinear relationship between laser power, microstructure, and bond strength, underscoring the critical role of laser power in the preparation of ink-jet printed films. Our findings provide new insights into enhancing the quality of W-SiC insulation films, with significant implications for the manufacturing of high-performance electronic components.